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GENERAL
BACKED SEMICONDUCTOR STRAIN GAGE
HALF BRIDGE - TEMPERATURE COMPENSATED |
- Backed SSGH’s are as easy to
install as foil gages
- There are two gages on a
backing, one longitudinal and one transverse.
- SSGH ’s are suggested for use in
prototyping or proof of concept
Micron
Instruments offers a range of
semiconductor backed half bridge strain gages. The gages are installed
on a flexible insulated circuit with easy to solder pads which can be
bent without hurting the gage and will perform like a foil gage except
that the resistive change is 30 to 55 times greater.
There are two
gages on a backing, one longitudinal and one transverse.
These gages are thermally matched to track each other before installing
onto the backing. When used as one side of the bridge, they compensate
each other thermally even when bonded since they both see the same
thermal expansion. When both gages have a gage factor (GF) of 140 the
transverse gage will normally see the Poisson’s effect, which for most
steels is 0.3. This reduces the transverse gage factor to 42. The
average GF for the half bridge would be 91.
Micron's semiconductor
strain gages are made from “P” doped bulk silicon. They have no P/N
junction. The silicon is etched to shape, eliminating the potential for molecular
dislocation or cracks, thereby optimizing performance. |
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Specifications |
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Material |
Czochralski
pulled boron doped silicon. |
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Leads |
.002 dia. gold. |
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Contact Pad |
Gold nickel
fused, aluminum, or Hi-Temp. |
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Lead Attachment |
Parallel gap
welded with epoxy reinforcement or ball bonded. |
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Operating Strain |
±2000 μ inch/inch ( 3000 μ inch/inch max.) |
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Linearity |
Better than
±0.25% to 600 μ
inch/inch
Better than ±1.5% to 1500 μ inch/inch |
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Max. Operating Temp. |
+278°F Bonded. |
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Solder Pads |
Copper |
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Dimensions (Base) |
.42 x .12 in. |
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Note: Bar gages ranges available 120 ohm
up to 1000 ohms |
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Schematic |
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Backed
Temperature Compensated
Semiconductor Strain Gages Half Bridge (SSGH) |
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PART
NUMBER |
Width |
Lead
Attachment |
Thickness |
Resistance
Ohms@78° F |
Gage
Factor |
TCGF |
TCR |
|
SS-060-022-500PB-SSGH |
.008 |
WL |
.0004 |
540 ±50 |
150 ±10 |
-13% |
17% |
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SS-060-033-500PB-SSGH |
.008 |
WL |
.0004 |
540 ±50 |
140 ±10 |
-13% |
15% |
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SS-060-033-1000PB-SSGH |
.008 |
WL |
.0004 |
1050 ±75 |
155 ±10 |
-18% |
24% |
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SS-080-050-120PB-SSGH |
.008 |
WL |
.0004 |
120 ±20 |
120 ±10 |
-9% |
5% |
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SS-080-050-230PB-SSGH |
.008 |
WL |
.0004 |
230 ±30 |
120 ±10 |
-9% |
5% |
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SS-080-050-345PB-SSGH |
.008 |
WL |
.0004 |
345 ±40 |
140 ±10 |
-13% |
16% |
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SS-080-050-500PB-SSGH |
.008 |
WL |
.0004 |
540 ±50 |
140 ±10 |
-13% |
16% |
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SS-080-050-1000PB-SSGH |
.008 |
WL |
.0004 |
1050±75 |
150 ±10 |
-18% |
24% |
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SS-090-060-500PB-SSGH |
.009 |
WL |
.0004 |
540 ±50 |
140 ±10 |
-13% |
16% |
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SS-090-060-500PB-SSGH |
.008 |
WL |
.0004 |
1050±75 |
155 ±10 |
-18% |
24% |
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Standard
Bridge Matching |
| Temperature °F
|
0° |
78° |
278° |
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| Standard
Matching |
±0.6% |
±0.4% |
±0.4% |
Percent of Base Resistance |
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Semiconductor Strain Gage FAQ'S |
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